Studies on Mechanical, Electrical and Thermal properties of compatibilized PLA\ABS blends reinforced with Non Treated and Treated Wood Flour

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Studies on Mechanical, Electrical and Thermal properties of compatibilized PLA\ABS blends reinforced with Non Treated and Treated Wood Flour

Author Name: R.Anandharaj and S.Soundararajan | Format: Paperback | Genre : Educational & Professional | Other Details

Poly Lactic Acid (PLA) bio-polymer (60%) was blended with Acrylonitrile Butadiene Styrene (ABS) (40%) and filled with non-treated and treated Wood flour (0%, 10%, 20%) using a Twin screw compounding extruder with and without a suitable compatiblizer, ABS-g-MAH, 5% and Glycerol is used 4% for sticking agent between polymer and wood flour. The treated wood flour reinforced PLA/ABS blend was having higher impact strength, tensile modulus compared to virgin PLA material. The tensile Strength, elongation at break and hardness were slightly lowered due to low rigidity of the impact modifier ABS, but the tensile modulus was increased. But the flexural strength and modulus, impact Strength of 10% treated wood flour reinforced PLA/ABS blend with using ABS-g-MAH as a compatibilizer was increased when compared to virgin PLA. The volume resistivity, surface resistivity and dielectric strength were also lowered in the non treated ones. Dielectric Strength was and the arc resistance was increased in the treated wood flour. It has self-extinguished property also in the arc resistance test. The water absorption was higher than virgin PLA material. The shrinkage, density, melt flow index was reduced due to the filler of treated wood flour. The heat deflection temperature was slightly increased by 4-5ºC.