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underfilladhesive

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices.

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices.

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. https://www.deepmaterialcn.com/epoxy-based-chip-underfill.htmlRead More...