Home
Profile
  • IN
    • India
    • Singapore
    • Malaysia
  • 0

adhesiveLow temperature curing epoxy

This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable

This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.Read More...


Edit Your Profile

Maximum file size: 5 MB.
Supported File format: .jpg, .jpeg, .png.
https://notionpress.com/author/