"It was a wonderful experience interacting with you and appreciate the way you have planned and executed the whole publication process within the agreed timelines.”
Subrat SaurabhAuthor of Kuch Woh PalThis book is dedicated to the Adhesive Industry, especially for the Tape, Sealant, and Lamination Industry. In this book, the author has offered the Starting Point Formulations in order to manufacture various kinds of adhesives, sealants, and coating for a variety of manufacturing plants.
Being an SPA Technical Advisor’s Proprietor, the author of this book has based its core content from his experience as a senior technocrat associated with the Rubber and Adhesive Tape Industry for the past 44 years in areas like Production, R&D, and setting up of new plants as well as commissioning.
Shrikant P. Athavale
Shrikant P. Athavale is a science graduate (1973) with a post-graduation in rubber technology from Plastics and Rubber Institute (PRI), London. He has experience in the rubber industry for over 11 years and the adhesive tape industry for over 33 years, in manufacturing, production and research and development.
He also has 3 Indian patents to his credit. He has published 5 technical books and has presented many technical papers at national and international conferences at USA (PSTC, ASC), MKVS, Munich, Germany, Ichemco, Italy, India (ATMA) and Bangkok, Thailand as well as two technical papers for the Rubber Expo 2018.
Currently, the author is engaged in his own technical advisory firm that provides technical know-how in the field of rubber and adhesive tapes. He has also been appointed as Technical Advisor for Harrisons Malayalam Ltd and EBRD (European Bank for Reconstruction and Development)
